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NUF3101FC Three Line EMI Filter
This device is a three-line EMI filter array for SIM Card wireless applications. Greater than -25 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. ESD protection is provided across all capacitors.
Features
* EMI Filtering and ESD Protection * Integration of 10 Discretes * Provides Protection for IEC61000-4-2 (Level 4)

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C2 A3 B3 100 R C3 C1 100 R 47 R
A2 B1
* * * *
8.0 kV (Contact) 15 kV (Air) Flip-Chip Package Moisture Sensitivity Level 1 ESD Rating: Machine Model = C; Human Body Model = 3B Pb-Free Package is Available*
Benefits
* Reduces EMI/RFI Emissions on a Data Line * Integrated Solution Offers Cost and Space Savings * Reduces Parasitic Inductances Which Offer a More "Ideal" * * * * *
Low Pass Filter Response Integrated Solution Improves System Reliability
B2 GND
MARKING DIAGRAM
A2 8-Pin Flip-Chip FC SUFFIX CASE 499AG 3101 A Y WW G 1 3101 AYWW G G
Applications
SIM Card EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Products
= Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package
(Note: Microdot may be in either location)
MAXIMUM RATINGS (TA = 25C unless otherwise noted)
Rating ESD Discharge IEC61000-4-2 Air Discharge Contact Discharge PR PT TOP TSTG TJ Symbol VPP Value 15 8.0 100 300 -40 to +85 -55 to +150 +125 mW mW C C C Unit kV
PIN CONFIGURATION
A3 A2
Steady-State Power per Resistor Steady-State Power per Package Operating Temperature Range Storage Temperature Range Junction Temperature
B3
B2
B1
C3
C2
C1
ORDERING INFORMATION
Device NUF3101FCT1 NUF3101FCT1G Package Flip-Chip Flip-Chip (Pb-Free) Shipping 3000 Tape & Reel 3000 Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF3101FC/D
(c) Semiconductor Components Industries, LLC, 2006
March, 2006 - Rev. 2
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NUF3101FC
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Series Resistance Series Resistance Series Resistance Capacitance Cut-Off Frequency Symbol VRWM VBR IR R1 R2 R3 CLINE 1 f3dB Test Conditions - IR = 1.0 mA VRM = 3.0 V - - - f = 1.0 MHz, 0 Vdc 50 W Source and 50 W Load Termination Min - 6.0 - 80 38 80 - 100 Typ - - - 100 47 100 - - Max 5.6 8.0 0.1 120 56 120 40 300 Unit V V mA W W W pF MHz
TYPICAL PERFORMANCE CURVES
(TA = 25C unless otherwise specified) 0 -5 -10 S21 (dB) -15 -20 -25 -30 -35 1.0E+07 C3-C1 1.0E+08 1.0E+09 1.0E+10 A3-A2 B3-B1
FREQUENCY (Hz)
Figure 1. Insertion Loss Characteristics
45 40 35 CAPACITANCE (pF) 30 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 A3-B2 C2-B2 C3-B2 RESISTANCE (%) B3-B2
104 103 102 101 100 99 98 97 96 95 -40 -15 10 35 60 85
REVERSE VOLTAGE (V)
TEMPERATURE (C)
Figure 2. Typical Line Capacitance vs. Reverse Bias Voltage
Figure 3. Typical Normalized Resistance Over Temperature
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NUF3101FC
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width Copper Solder mask 500 mm Pitch 300 or 350 mm Solder Ball 250 mm +25 -0 Round NSMD 350 mm "25 125 mm 250 x 250 mm sq. 50/50 No Clean Type 3 or Finer OSP Cu 150 mm Max
NSMD
SMD
Figure 4. NSMD vs. SMD
Tp = (15-30 sec) Tp = 260C - 5C RAMP-UP
0- 15 - 30 - 45 - 60 - 75 - 90 - 105 - 119 - 134 - 149 - 165 - 180 - 195 - 209 - 224 - 239 - 254 - 269 - 284 - 299 - 314 - 329 - 344 - 359 - 374 - 389 - 404 - 419 - 434 - 449 - 464 - 479 - 494 -
280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0
- - - - - - - - - - - - - - - - - - - - - - - - - - - -
TEMPERATURE (C)
tL (60-90 sec)
RAMP-DOWN
PRE-HEAT ZONE
TIME (seconds)
Figure 5. Typical Pb-Free Solder Heating Profile
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NUF3101FC
PACKAGE DIMENSIONS
8 PIN FLIP-CHIP FC SUFFIX CASE 499AG-01 ISSUE A
4X
A D
0.10 C
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS DIM MIN MAX A --- 0.700 A1 0.210 0.270 A2 0.380 0.430 D 1.550 BSC E 1.550 BSC b 0.290 0.340 e 0.500 BSC D1 1.000 BSC E1 1.000 BSC
PIN ONE LOCATION
E
TOP VIEW A2 A C A1 SIDE VIEW D1 e
C B A 8X
0.10 C
0.05 C
SEATING PLANE
E1
b
1
2
3
0.05 C A B 0.03 C
BOTTOM VIEW
e
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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NUF3101FC/D

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